Home / Technology / The Core i5-9400F has a paste instead of a solder. And the silicon overlaid?

The Core i5-9400F has a paste instead of a solder. And the silicon overlaid?



When Intel released the first ninth generation of core processors in the fall (unlocked models Core 5-9600K, i7-9700K and i9-9900K), the most important change was that the "hood", more specifically the heat distributor, was soldered for a long time after a long time. to use just plain pasta. This CPU also has lower load temperatures (at least if consumption is identical) and better cooling. However, the solder will not be used on all Coffee Lake Refresh processors. The cheaper six-core Core i5-9400 and i5-9400F (we wrote about them here), which are now starting to sell, have already been driven confirmed to be over. In addition, they also come with other differences from higher models of the ninth stationary generation

Models Lock Lake Refresh has a paste

Delidy model Core i5-9400F appeared in Asia – this video has more images twitter 188 19 / Momomo_us . As you can see, the pictures show thermal conductive paste. Just like AMD at APU Raven Ridge, Intel uses only one paste instead of soldering in this lower range. Due to overclocking and lower cost for these processors, it is inappropriate to criticize that cheaper models have been kept fairly common in the old days before Intel returned from the solder 2012.

Delid Core i5-9400F (Source: 눈 쟁이, Youtube) [19659010] Delid also showed that while the six-core i5-9600K has a partially deactivated eight core silicon and i7-9700K and i9-9900K, the models i5-9400F and i5-9400 (for which we do not have pictures but it is unlikely would be different ) are different. The content is a smaller chip, apparently physically six-core

Delivered Core i5-9400F versus Core i5-9600K with eight chip chip (19389007)

Stepping U0 =

Respectively – it should be. According to the motherboard table, there may be two versions. Core i5-9400 and 9400F, according to them, exist in step U0 as you see here on the pictures (and in the gallery), but also in step P0. Stepping P0 is an eight-core chip, which is described in the unlocked models. Stepping U0 is on the eighth generation processor, i5-8400, i5-8700K, etc. In CPU-Z or HWiNFO, i5-9400F reports identically to i5-8400 and probably you will see another version of the microcode

Step U0 and P0 for the eighth and ninth Intel processors in the list of CPUs supported by MSI

But the sex kernel with step-P0 is probably rare, so it seems to sell everywhere version U0. By the way, Core i9-9900KF and i7-9700KF are probably only versions with step P0, which is naturally based on eight nuclear silicon

Photographs confirm that the Core i5-9400F U0 really resembles the processors of the eighth generation. The components on the bottom of the chip are distributed identically (if I look good). A similar situation was remembered for Quad-core Coffee Lake, which made the case exactly like Kaby Lake. And it also had the same pitch (B0 instead of U0) as well as 2400MHz DDR4 support. As you can see, the components on the underside of the substrate on the eighth core look unlocked processors from the ninth generation different than the i5-9400F and i7-8086K

Core i9-9900K, Core i5-9400F Core i7-8086K.

The plate is thinner than the unlocked chips, but stronger than the previous generation

But "labeled" seems to i5-9400 (F) is also not. If you look at a profile shot, you can see that these processors have a different, less thick substrate (PCB chip under the chip) than the unlocked 9000 models. But it's not the same substrate as for Coffee Lake. Chips of generation 8000 have a substrate even thinner, the i5-9400F on the image still has a stronger, but not as many as i9-9900K. In other words, Intel has reinforced the substrate and apparently slightly reduced the heat sink. Core i9-9900K, Core i5-9400F and Core i7-8086K. Observe the different substrate thicknesses (Source: 188 号)

Make the step U0 fix bugs

The question is obvious whether i5-9400 (F) does not have old silicon on the new substrate. If roasting is still U0 as 8000 chips, it can really be identical chips. This would hardly have any significant consequences, apart from one thing. Generation 9000 has hardware corrected melting errors (as well as L1 Terminal Fault / Foreshadow). But if the 9400 / 9400F chips and other similar models with step U0 are really redesigned by Coffee Lake, they would still be vulnerable to Meltdown. Therefore, they would need repairs in an operating system that does something.

See also: Core i5-9400F Core i5-9400F

Core i5-9400F is deceived, inside has a paste. And maybe a ripped old silicon

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